الفهرس 
RAPID SOLIDIFICATIONOnly 14 pages are availabe for public view
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Abstract
Due to the toxicity of Lead present in LeadTin solder alloys, there is a legislation to eliminate the use of lead in industrial applications specially that based in the soldering technology that used in the microelectronic applications. So that, four groups of the Leadfree solder alloys were prepared by melt spinning technique as a trial to form and characterize a leadfree solder alloy has the same properties of those of leadtin solder alloys. The first group is a set of binary lead free solder alloy , the second group is a set of the ternary lead free solder alloy, the third is a set of quaternary lead free solder alloys, while the fourth is a set of penternary lead free solder alloys. To study the properties of these alloys, the following techniques: Xray Diffraction, Scanning Electron Microscope, DTA, Double bridge circuit, Dynamic Young<U+2019>s Modulus, and Vickers Hardness Microscope were used to identify the structure, melting, electrical, mechanical and hardness values of these alloys. The results indicate that, the penternary alloy of the composition SnZn1Bi2Cu5In has properties superior to those of the binary, ternary, and quaternary alloys required for solder applications. Since it has a lower melting point, low value of the contact angle (very close to that for PbSn), electrical resistivity very close to that for PbSn, higher value of the Young<U+2019>s modulus and Vickers hardness value than those for the leadfree solder alloy.