الفهرس 
CHAPTER IOnly 14 pages are availabe for public view
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Abstract
The present thesis is devoted to study:
1) Thermal analysis and microstructure evolutions of SC07, SC07-0.4TiO2, SC07-0.8TiO2, SC07-0.4Ni, SC07-0.8Ni, SC07-0.4In, and SC07-0.8In solder alloys.
2) The effect of strain rates ε• from 2.3×10−4 up to 1.1x10-3 s-1 and testing temperatures T in the range of 25 to 100 oC on stress-strain characteristics of tested solder wire samples.
3) Indentation creep characteristics using Vickers hardness tester of the tested solder alloys. The experimental results were investigated under different loads, 10, 50 and 100 gf at room temperature.