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العنوان
Heat Flow Investigation of Copper Matrix Composites as Electronic Component Coolants /
المؤلف
Swidan, Ahmed Hamdy Ahmed.
هيئة الاعداد
باحث / احمد حمدي احمد سويدان
مشرف / وليد محمد رشيد محمد داعوش
مشرف / محمد عبدالحليم محمد
مشرف / جمال بدير عبدالعزيز
مناقش / محمد عبدالخالق محمود
مناقش / محمد احمد معوض
الموضوع
Heat sinks. Powder Metallurgy. Heat Transfer.
تاريخ النشر
2016.
عدد الصفحات
i-vi, 154 p. :
اللغة
الإنجليزية
الدرجة
ماجستير
التخصص
الهندسة الميكانيكية
الناشر
تاريخ الإجازة
1/1/2016
مكان الإجازة
جامعة السويس - المكتبة المركزية - الميكانيكا
الفهرس
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Abstract

The heat generated during the operation of electric systems and components is an essential issue in electronics and electric circuits industry. Heat sinks and air cooling applications for protecting circuits and components from the generated heat and avoid failure and overheating problems by developing materials which have better behavior in this issue through an air cooling system where materials used as heat sinks. A powder metallurgy process is used for producing a sample material from copper (Cu) and copper based composites. Six composites samples which as copper (Cu) ,copper/diamond (Cu-Di), copper/graphite (Cu-Gr), copper/ graphite coated by silver (Cu-Gr coated Ag), copper/carbon fiber(Cu-CF),copper/carbon fiber coated by copper (Cu-CF coated by Cu). We tests have been conducted including (X-ray diffraction analysis (XRD) and Scanning Electron Microscope (SEM) equipped with an Energy Dispersive Spectrometer (EDS) in addition to heat transfer testing, results obtained including material composition, density, electrical resistance and thermal conductivity. Data collected and evaluated, the coated material introduced better results for heat transfer and effective performance have been shown to be used in heat sinks applications.